The South Korean electronics giant has announced plans to commence mass production of its newest 290-layer ninth-generation vertical (V9) NAND chips, aimed at AI and cloud devices as well as large-scale enterprise servers.
The Korea Economic Daily says the major chipmakers are now “engaged in a game of chicken in a race to develop advanced chip stacking technology to cut costs and improve performance.” It points out that Samsung has previously announced plans to develop over 1,000-layer NAND chips by 2030.
A 100 TB Nand Drive for $500 a pop will decimate the HDD industry