https://www.youtube.com/watch?v=GSuTyOMq1Bg
https://www.reuters.com/technology/applied-materials-unveils-new-chip-tool-lower-cost-lithography-process-2023-02-28/
4 replies (most recent on top)
Transfer litho problem to etch has been going on for more than a decade. This is a small piece.
How are they realistically going to scale this technology if they can no longer electromagnetically titillate the air to make silicon fall out?
Interesting, more advancements in pitch doubling (Or halving depending on your introduction to this concept 16 years ago). With the advance of EUV the key enabler is the removal of needing to do these tricks to decrease feature size. Will come down to economics. Pitch Double/Quad is pricey, so is EUV. Going disaggregate makes al ot of sense, only go crazy tight feature size where performance makes up for the cost. Most things can be single patterned with old litho tech.
1 out of 5000 Intel employees know basically what this article is describing