Anyone here know what happened to ATTD chandler folks during 2016 layoff?
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The thing is that packaging in one of the key future technologies now that semiconductors approach atomic levels of density. In competing with TSMC is doing to be difficult because of the shear scale of TSMC and the diversity of customers. TSMCs R&D gets buttered over a lot more products. For example wireless chips, it was actually cheaper to make them at TSMC than internal to Intel to show just how Intel is cost models ineffective. The Intel package technology portfolio is really thin to offer in something like a foundry business. I worked on a product concept were we wanted to do old school wire bond, ATTD wanted 100 Million to bring up the technology.
ATTD is kind of messed organization, politics and diversity is the focus in the org along with most other TMG orgs. Lots of Intel inbreeding in these orgs also.
The actions very proportionate to the rest of the company. A group was fired, walked out the first day. The majority took vsp or retired. A lot of retirements.
@dwr Salary reset to lower levels, with younger and less expensive "engineers".
I am seeing a lot of packaging Eng job Ads on LinkedIn. Does that mean no layoff?