https://www.reuters.com/technology/intel-manufacturing-business-suffers-setback-broadcom-tests-disappoint-sources-2024-09-04/
The tests conducted by Broadcom involved sending silicon wafers - the foot-wide discs on which chips are printed - through Intel's most advanced manufacturing process known as 18A, the sources said. Broadcom received the wafers back from Intel last month. After its engineers and executives studied the results, the company concluded the manufacturing process is not yet viable to move to high-volume production.