Hock Tan said there are only 2 or 3 layers between him and IC. However, currently, we still have 6 or 7 layers in between. How could these be flattened out to 2 to 3 layers?
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If you are a Senior Director or Senior Manager at VMW, expect that many will be eliminated in the upcoming rounds of layoffs. Broadcom Software doesn't have as many layers. AVGO BUs are not all the same. There isn't enough profit margin in legacy software once the prices are raised and customers seek other solution options.
It does take time to remove the layers. But eventually, it will be more flat than now.
Feel free to check the existing Broadcom BUs in google contacts. It is common to have 5~6 layers everywhere.
This is an excellent point. I also spent some time looking at BC existing employees and the number of layers is very similar to what we have in VMware now. There are 4 and 5 layers between Hock and the IC everywhere I looked.
ic-mgr-dir-vp-gm-God
Feel free to check the existing Broadcom BUs in google contacts. It is common to have 5~6 layers everywhere.
If you want to know how they are going to remove the layers you are at the right place. Just standby for the upcoming news. It will be rolling out for months to come.
Same number of layers on my team as before. BC is all projection and BS so far it seems.
As of tomorrow DMT management has zero input on approvals for deals so that's how they will be gotten rid of - nothing to do!!!
IC -> mgr -> Dir -> Sr Dir -> GM -> SVP -> CEO
By flat it means there shouldn't be more than one title at the same level for the same product line
That's the easiest part. Management that performs excessive micromanagement, have tons of pet projects and takes up resources (no contribution to the revenue stream) are good candidates. All these are in the records by now. The management pyramid is built based on that, and Hock is going to look at the pyramid now. Hock is not interested in spending time and resources on innovation and AI. What makes him interested in things that waste his money? Good luck.
Management flattening is coming up soon in next round.